BLULINE II BD50 - Singulus Technologies AG
BLULINE II BD50 - Singulus Technologies AG
BLULINE II BD50 - Singulus Technologies AG
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<strong>BLULINE</strong> <strong>II</strong> <strong>BD50</strong><br />
Enabling the Blu-ray Future<br />
Smart Solutions to Drive the Future.
02<br />
<strong>BLULINE</strong> <strong>II</strong><br />
Replication of Dual Layer Blu-ray Disc<br />
Hollywood Studios want to take advantage<br />
of the enormous storage capacity of a <strong>BD50</strong><br />
disc in order to deliver an unprecedented video<br />
and audio experience in Hi-def quality to the<br />
home consumer. For this reason, the availability<br />
of 50 GB Dual Layer Blu-ray Discs is a clear<br />
must for these formats.<br />
The Blu-ray format has definitively established<br />
itself as the new standard in the market. Highdefinition<br />
television, HDTV (HD Ready and Full HD),<br />
combined with the Blu-ray video format, is the<br />
new technology of the media sector. The market<br />
introduction of the 50 GB Dual Layer Blu-ray Disc<br />
was a show-stopper for the entertainment industry.<br />
The high storage capacity of the format enables<br />
optimum audio and video high-definition quality<br />
and also offers the ability to store bonus material<br />
such as additional trailers, interviews with directors<br />
and stars as well as BD-Java-based applications,<br />
enabling viewers to enjoy an interactive movie<br />
experience never before possible.<br />
SINGULUS' experience in the field of Blu-ray<br />
goes back to its early, exclusive partnership<br />
with the format developer Sony in 2005.<br />
SINGULUS has already installed several Blu-ray<br />
production lines at the biggest independent<br />
disc manufacturers.<br />
The SINGULUS Blu-ray Disc production system<br />
<strong>BLULINE</strong> <strong>II</strong> is designed for the economical<br />
production of Blu-ray Discs (BD ROM Single<br />
Layer and Dual Layer (BD ROM SL/DL), according<br />
to the specifications issued by the BDA.<br />
All production steps from molding, cooling,<br />
metallizing, wet-embossing, lacquering and UV<br />
curing to quality inspection are incorporated in<br />
the <strong>BLULINE</strong> <strong>II</strong>. Its functionality, speed and design<br />
will again set a new benchmark for the industry.<br />
The <strong>BLULINE</strong> <strong>II</strong> operates with one molding<br />
machine and comprises all the advanced features<br />
required for production of high end Dual Layer<br />
Blu-ray Discs.<br />
The most common technology for creating an<br />
additional information layer on a substrate surface<br />
is the the wet-embossing process. The benefit of<br />
the wet-embossing process is that it provides a<br />
very fine pit geometry and therefore generates a<br />
flawless electrical signal.<br />
This dual layer process requires an excellent<br />
uniformity of the space layer between the<br />
two information layers (approx. 25±1 micron).<br />
This space layer is created by our field proven<br />
spin coating process and uses resin heating<br />
and curing to achieve the required uniformity.<br />
Finally the <strong>BD50</strong> disc requires a precise 75 micron<br />
cover layer. This process will be performed in the<br />
standard cover layer unit.<br />
Every single <strong>BLULINE</strong> in the field can be upgraded<br />
with the embossing technology to produce 50 GB<br />
Blu-ray Discs.
The following features characterize the<br />
<strong>BLULINE</strong> <strong>II</strong> concept:<br />
_ Dedicated to production of BD ROM SL/DL<br />
_ Cycle time BD SL < 4.0 s / BD DL < 6.0 s<br />
_ Highly integrated design<br />
_ All production steps included<br />
_ Thickness Measurement Device (TMD)<br />
for metallized layers with close loop<br />
control for the cathode<br />
_ Spectrometer for spacer-layer and<br />
cover-layer measuring with close loop<br />
control for spin process<br />
_ High productivity, high uptime<br />
_ Clear structured disc flow<br />
_ Automated handling of BD through all<br />
production steps<br />
_ Minimum space required
Sputter Station for Layer 0<br />
and Layer 1 Metallization<br />
For metallization of the molded Blu-ray Discs<br />
substrates with Layer 0 full-reflective material,<br />
one high sputter rate SINGULUS V module with<br />
the patented SMART Cathode ® is used. Silver<br />
Alloy is sputtered with a layer thickness of<br />
approx. 35 nm. For the second metallization<br />
of the wet-embossed disc with Layer 1 semireflective<br />
material, the same sputter station is<br />
used. A second sputter module is used for<br />
sputtering the label side of the disc with a<br />
moisture barrier.<br />
Dual Layer Cover-Layer Unit<br />
Lacquering for the cover layer takes place on<br />
a double track module for high throughput.<br />
Each track consists of one lacquer dispense<br />
system, two spin bowls and one IR lamp. One<br />
Xenon pulsed UV lamp is used altered for both<br />
tracks. By using the second spin bowl, a mask<br />
and the influence of heat from the IR lamp,<br />
a homogeneous thickness of cover layer is<br />
achieved. The combination of the UV station<br />
and an additional spin bowl creates a uniform<br />
shape and outer edge on the disc.<br />
05<br />
Concept<br />
Wet-Embossing Station<br />
The Layer 1 wet-embossing station is the key<br />
unit of the dual-layer application. This unit is built<br />
with a 4-position turntable and one embossing<br />
head. The embossing head is designed for the L1<br />
wet-embossing process with a Nickel stamper in<br />
the uncured pit-transfer resin. The Layer 0 disc<br />
is loaded onto a quartz glass for embossing and<br />
is centered with a center pin. The Layer 1 stamper<br />
is mounted onto to the top side of the embossing<br />
head and is supported by vacuum and a<br />
mechanical stamper holder.
06<br />
Main Components<br />
1 Injection Molding<br />
SINGULUS has qualified the MoldPro All-Electric<br />
molding machine for Blu-ray Disc production.<br />
Other qualified molding machines can be<br />
integrated on request.<br />
2 Cooling Conveyor<br />
A linear cooling conveyor transports the discs in<br />
a horizontal position through a separate conveyor<br />
belt to the downstream. This additional cooling<br />
of the substrates during transportation provides<br />
a uniform temperature distribution over the disc<br />
surface.<br />
3 Layer 0 Metallization<br />
A high-rate SINGULUS V sputter module with<br />
the patented SMART Cathode ® is used for<br />
the metallization of the molded Blu ray Disc<br />
substrates with Layer 0 full-reflective material.<br />
Silver Alloy is sputtered with a layer thickness<br />
of approx. 35 nm.<br />
4 Base Resin<br />
Lacquering takes place on a double track module<br />
for high throughput. Both tracks are connected to<br />
one lacquer dispense system, two spin bowls and<br />
one IR lamp. One Xenon pulsed UV lamp is used<br />
for each track. The combination of a spin bowl<br />
and the UV station creates a uniform shape and<br />
outer edge on the disc.<br />
5 Pit-Transfer-Resin<br />
This unit consists of one lacquer dispense systems<br />
and two spin bowls. The discs are transported<br />
by one handling system. Once the metallized and<br />
resign-coated disc reaches the first position, a<br />
highly accurate circular ring of lacquering agent is<br />
applied onto the disc with 2 µm pit-transfer-resin.<br />
6 Pre Curing<br />
A one-position turntable to pre-cure the center of<br />
the lacquered Blu-ray Discs is positioned just prior<br />
the wet-embossing station.<br />
7 Wet-Embossing Station<br />
The Layer 1 wet-embossing station is the key unit<br />
of the dual-layer application. This unit is built with<br />
a 4-position turntable and one embossing head.<br />
The embossing head is designed for the L1<br />
wet-embossing process with a Nickel stamper in<br />
the uncured pit-transfer resin. The Layer 0 disc is<br />
loaded onto a quartz glass for embossing and is<br />
centered with a center pin. The Layer 1 stamper<br />
is mounted onto to the top side of the embossing<br />
head and is supported by vacuum and a mechanical<br />
stamper holder.<br />
8 Layer 1 Metallization<br />
For the second metallization of the wet-embossed<br />
disc with Layer 1 semi-reflective material, the same<br />
sputter station is used as for Layer 0. Silver Alloy<br />
is sputtered with a thickness of approx. 30 nm.<br />
9 Cover Layer<br />
Lacquering for the cover layer takes place on a<br />
double track module for high throughput. After UV<br />
curing, the disc is positioned directly under a<br />
spectrometer to measure the cover layer thickness<br />
and uniformity. With these results, a closed loop<br />
cover layer control is generated to ensure constant<br />
thickness and uniformity.<br />
10 Hard Coating<br />
The hard coat is performed with a spin process,<br />
ensuring a very thin and uniform distribution of<br />
the hard coat material. Afterwards, the disc will<br />
be UV-cured and positioned on the conveyor.<br />
A flip-over handling arm brings the print side of<br />
the disc facing up.<br />
11 Barrier Layer<br />
A SINGULUS V module is used for sputtering the<br />
label side of the disc with a moisture barrier. SiN is<br />
sputtered with a layer thickness of approx. 10 nm.<br />
12 Final Inspection<br />
The unique layer thickness measuring system<br />
controls the layer thickness and layer uniformity<br />
of each metallized substrate automatically.
Main Features<br />
Format BD ROM<br />
Single Layer & Dual Layer<br />
Cycle time DL < 6.0 s<br />
SL < 4.0 s<br />
Space layer 25 µm<br />
Cover layer BD DL 75 µm<br />
Cover layer BD SL 100 µm<br />
Metallization<br />
Fully reflective layer Ag+ (approx. 35 nm)<br />
Semi reflective layer Ag+ (approx. 30 nm)<br />
Barrier layer SiN (approx. 10 nm)<br />
Available Options<br />
Adaption of BCA module<br />
Dimensions <strong>BLULINE</strong> <strong>II</strong><br />
(with MoldPro Injection Molding Machine)<br />
Length 4500 mm<br />
Width 3700 mm<br />
Height 2080 mm<br />
7<br />
5<br />
4 9<br />
6<br />
3<br />
1<br />
8<br />
2<br />
11<br />
10<br />
12<br />
07
Headquarters<br />
SINGULUS TECHNOLOGIES <strong>AG</strong><br />
Hanauer Landstrasse 103<br />
D - 63796 Kahl, Germany<br />
Tel. +49 6188 440-0<br />
Fax +49 6188 440-110<br />
sales@singulus.de<br />
www.singulus.de<br />
Affiliated Companies<br />
Germany<br />
HamaTech APE GmbH & Co. KG<br />
Tel. +49 7045 41-8<br />
info@hamatech-ape.com<br />
SINGULUS NANO DEPOSITION<br />
TECHNOLOGIES GMBH<br />
Tel. +49 6188 440-417<br />
info@singulus-ndt.de<br />
STANGL Semiconductor<br />
Equipment <strong>AG</strong><br />
Tel. +49 8141 3600-0<br />
sales@stangl.de<br />
Netherlands<br />
SINGULUS MASTERING B.V.<br />
Tel. +31 407 5014-00<br />
info@singulus.nl<br />
Switzerland<br />
SINGULUS MOLDING <strong>AG</strong><br />
Tel. +41 52 63262-00<br />
sales@singulus-molding.ch<br />
Sales Subsidiaries<br />
France<br />
SINGULUS TECHNOLOGIES France S.A.R.L.<br />
Tel. +33 3 893111-29<br />
e-mail: singulus@club-internet.fr<br />
Great Britain<br />
SINGULUS TECHNOLOGIES UK Ltd.<br />
Tel. +44 1793 7842-00<br />
e-mail: brian.walsh@singulusuk.com<br />
Italy<br />
SINGULUS TECHNOLOGIES Italia s.r.l.<br />
Tel. +39 0717 9303-12<br />
e-mail: singulus.italia@fastnet.it<br />
Latin America<br />
SINGULUS TECHNOLOGIES Ltda. Latin America<br />
Tel. +55 1136 4301-13<br />
e-mail: latinamerica@singulus.com.br<br />
Smart Solutions to Drive the Future.<br />
Singapore<br />
SINGULUS TECHNOLOGIES Asia Pacific<br />
Tel. +65 674 119-12<br />
e-mail: singulus@singnet.com.sg<br />
Spain<br />
SINGULUS TECHNOLOGIES Iberica<br />
Tel. +34 936 7500-25<br />
e-mail: singulus@singulusib.com<br />
Taiwan<br />
SINGULUS TECHNOLOGIES Taiwan Ltd.<br />
Tel. +886 2 274833-66<br />
e-mail: sales@singulus.com.tw<br />
United States and Canada<br />
SINGULUS TECHNOLOGIES Inc.<br />
Tel. +1 860 68380-00<br />
e-mail: sales@singulus.com<br />
02/2008-MetaCom Printed in Germany - Technical alterations reserved