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BLULINE II BD50 - Singulus Technologies AG

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<strong>BLULINE</strong> <strong>II</strong> <strong>BD50</strong><br />

Enabling the Blu-ray Future<br />

Smart Solutions to Drive the Future.


02<br />

<strong>BLULINE</strong> <strong>II</strong><br />

Replication of Dual Layer Blu-ray Disc<br />

Hollywood Studios want to take advantage<br />

of the enormous storage capacity of a <strong>BD50</strong><br />

disc in order to deliver an unprecedented video<br />

and audio experience in Hi-def quality to the<br />

home consumer. For this reason, the availability<br />

of 50 GB Dual Layer Blu-ray Discs is a clear<br />

must for these formats.<br />

The Blu-ray format has definitively established<br />

itself as the new standard in the market. Highdefinition<br />

television, HDTV (HD Ready and Full HD),<br />

combined with the Blu-ray video format, is the<br />

new technology of the media sector. The market<br />

introduction of the 50 GB Dual Layer Blu-ray Disc<br />

was a show-stopper for the entertainment industry.<br />

The high storage capacity of the format enables<br />

optimum audio and video high-definition quality<br />

and also offers the ability to store bonus material<br />

such as additional trailers, interviews with directors<br />

and stars as well as BD-Java-based applications,<br />

enabling viewers to enjoy an interactive movie<br />

experience never before possible.<br />

SINGULUS' experience in the field of Blu-ray<br />

goes back to its early, exclusive partnership<br />

with the format developer Sony in 2005.<br />

SINGULUS has already installed several Blu-ray<br />

production lines at the biggest independent<br />

disc manufacturers.<br />

The SINGULUS Blu-ray Disc production system<br />

<strong>BLULINE</strong> <strong>II</strong> is designed for the economical<br />

production of Blu-ray Discs (BD ROM Single<br />

Layer and Dual Layer (BD ROM SL/DL), according<br />

to the specifications issued by the BDA.<br />

All production steps from molding, cooling,<br />

metallizing, wet-embossing, lacquering and UV<br />

curing to quality inspection are incorporated in<br />

the <strong>BLULINE</strong> <strong>II</strong>. Its functionality, speed and design<br />

will again set a new benchmark for the industry.<br />

The <strong>BLULINE</strong> <strong>II</strong> operates with one molding<br />

machine and comprises all the advanced features<br />

required for production of high end Dual Layer<br />

Blu-ray Discs.<br />

The most common technology for creating an<br />

additional information layer on a substrate surface<br />

is the the wet-embossing process. The benefit of<br />

the wet-embossing process is that it provides a<br />

very fine pit geometry and therefore generates a<br />

flawless electrical signal.<br />

This dual layer process requires an excellent<br />

uniformity of the space layer between the<br />

two information layers (approx. 25±1 micron).<br />

This space layer is created by our field proven<br />

spin coating process and uses resin heating<br />

and curing to achieve the required uniformity.<br />

Finally the <strong>BD50</strong> disc requires a precise 75 micron<br />

cover layer. This process will be performed in the<br />

standard cover layer unit.<br />

Every single <strong>BLULINE</strong> in the field can be upgraded<br />

with the embossing technology to produce 50 GB<br />

Blu-ray Discs.


The following features characterize the<br />

<strong>BLULINE</strong> <strong>II</strong> concept:<br />

_ Dedicated to production of BD ROM SL/DL<br />

_ Cycle time BD SL < 4.0 s / BD DL < 6.0 s<br />

_ Highly integrated design<br />

_ All production steps included<br />

_ Thickness Measurement Device (TMD)<br />

for metallized layers with close loop<br />

control for the cathode<br />

_ Spectrometer for spacer-layer and<br />

cover-layer measuring with close loop<br />

control for spin process<br />

_ High productivity, high uptime<br />

_ Clear structured disc flow<br />

_ Automated handling of BD through all<br />

production steps<br />

_ Minimum space required


Sputter Station for Layer 0<br />

and Layer 1 Metallization<br />

For metallization of the molded Blu-ray Discs<br />

substrates with Layer 0 full-reflective material,<br />

one high sputter rate SINGULUS V module with<br />

the patented SMART Cathode ® is used. Silver<br />

Alloy is sputtered with a layer thickness of<br />

approx. 35 nm. For the second metallization<br />

of the wet-embossed disc with Layer 1 semireflective<br />

material, the same sputter station is<br />

used. A second sputter module is used for<br />

sputtering the label side of the disc with a<br />

moisture barrier.<br />

Dual Layer Cover-Layer Unit<br />

Lacquering for the cover layer takes place on<br />

a double track module for high throughput.<br />

Each track consists of one lacquer dispense<br />

system, two spin bowls and one IR lamp. One<br />

Xenon pulsed UV lamp is used altered for both<br />

tracks. By using the second spin bowl, a mask<br />

and the influence of heat from the IR lamp,<br />

a homogeneous thickness of cover layer is<br />

achieved. The combination of the UV station<br />

and an additional spin bowl creates a uniform<br />

shape and outer edge on the disc.<br />

05<br />

Concept<br />

Wet-Embossing Station<br />

The Layer 1 wet-embossing station is the key<br />

unit of the dual-layer application. This unit is built<br />

with a 4-position turntable and one embossing<br />

head. The embossing head is designed for the L1<br />

wet-embossing process with a Nickel stamper in<br />

the uncured pit-transfer resin. The Layer 0 disc<br />

is loaded onto a quartz glass for embossing and<br />

is centered with a center pin. The Layer 1 stamper<br />

is mounted onto to the top side of the embossing<br />

head and is supported by vacuum and a<br />

mechanical stamper holder.


06<br />

Main Components<br />

1 Injection Molding<br />

SINGULUS has qualified the MoldPro All-Electric<br />

molding machine for Blu-ray Disc production.<br />

Other qualified molding machines can be<br />

integrated on request.<br />

2 Cooling Conveyor<br />

A linear cooling conveyor transports the discs in<br />

a horizontal position through a separate conveyor<br />

belt to the downstream. This additional cooling<br />

of the substrates during transportation provides<br />

a uniform temperature distribution over the disc<br />

surface.<br />

3 Layer 0 Metallization<br />

A high-rate SINGULUS V sputter module with<br />

the patented SMART Cathode ® is used for<br />

the metallization of the molded Blu ray Disc<br />

substrates with Layer 0 full-reflective material.<br />

Silver Alloy is sputtered with a layer thickness<br />

of approx. 35 nm.<br />

4 Base Resin<br />

Lacquering takes place on a double track module<br />

for high throughput. Both tracks are connected to<br />

one lacquer dispense system, two spin bowls and<br />

one IR lamp. One Xenon pulsed UV lamp is used<br />

for each track. The combination of a spin bowl<br />

and the UV station creates a uniform shape and<br />

outer edge on the disc.<br />

5 Pit-Transfer-Resin<br />

This unit consists of one lacquer dispense systems<br />

and two spin bowls. The discs are transported<br />

by one handling system. Once the metallized and<br />

resign-coated disc reaches the first position, a<br />

highly accurate circular ring of lacquering agent is<br />

applied onto the disc with 2 µm pit-transfer-resin.<br />

6 Pre Curing<br />

A one-position turntable to pre-cure the center of<br />

the lacquered Blu-ray Discs is positioned just prior<br />

the wet-embossing station.<br />

7 Wet-Embossing Station<br />

The Layer 1 wet-embossing station is the key unit<br />

of the dual-layer application. This unit is built with<br />

a 4-position turntable and one embossing head.<br />

The embossing head is designed for the L1<br />

wet-embossing process with a Nickel stamper in<br />

the uncured pit-transfer resin. The Layer 0 disc is<br />

loaded onto a quartz glass for embossing and is<br />

centered with a center pin. The Layer 1 stamper<br />

is mounted onto to the top side of the embossing<br />

head and is supported by vacuum and a mechanical<br />

stamper holder.<br />

8 Layer 1 Metallization<br />

For the second metallization of the wet-embossed<br />

disc with Layer 1 semi-reflective material, the same<br />

sputter station is used as for Layer 0. Silver Alloy<br />

is sputtered with a thickness of approx. 30 nm.<br />

9 Cover Layer<br />

Lacquering for the cover layer takes place on a<br />

double track module for high throughput. After UV<br />

curing, the disc is positioned directly under a<br />

spectrometer to measure the cover layer thickness<br />

and uniformity. With these results, a closed loop<br />

cover layer control is generated to ensure constant<br />

thickness and uniformity.<br />

10 Hard Coating<br />

The hard coat is performed with a spin process,<br />

ensuring a very thin and uniform distribution of<br />

the hard coat material. Afterwards, the disc will<br />

be UV-cured and positioned on the conveyor.<br />

A flip-over handling arm brings the print side of<br />

the disc facing up.<br />

11 Barrier Layer<br />

A SINGULUS V module is used for sputtering the<br />

label side of the disc with a moisture barrier. SiN is<br />

sputtered with a layer thickness of approx. 10 nm.<br />

12 Final Inspection<br />

The unique layer thickness measuring system<br />

controls the layer thickness and layer uniformity<br />

of each metallized substrate automatically.


Main Features<br />

Format BD ROM<br />

Single Layer & Dual Layer<br />

Cycle time DL < 6.0 s<br />

SL < 4.0 s<br />

Space layer 25 µm<br />

Cover layer BD DL 75 µm<br />

Cover layer BD SL 100 µm<br />

Metallization<br />

Fully reflective layer Ag+ (approx. 35 nm)<br />

Semi reflective layer Ag+ (approx. 30 nm)<br />

Barrier layer SiN (approx. 10 nm)<br />

Available Options<br />

Adaption of BCA module<br />

Dimensions <strong>BLULINE</strong> <strong>II</strong><br />

(with MoldPro Injection Molding Machine)<br />

Length 4500 mm<br />

Width 3700 mm<br />

Height 2080 mm<br />

7<br />

5<br />

4 9<br />

6<br />

3<br />

1<br />

8<br />

2<br />

11<br />

10<br />

12<br />

07


Headquarters<br />

SINGULUS TECHNOLOGIES <strong>AG</strong><br />

Hanauer Landstrasse 103<br />

D - 63796 Kahl, Germany<br />

Tel. +49 6188 440-0<br />

Fax +49 6188 440-110<br />

sales@singulus.de<br />

www.singulus.de<br />

Affiliated Companies<br />

Germany<br />

HamaTech APE GmbH & Co. KG<br />

Tel. +49 7045 41-8<br />

info@hamatech-ape.com<br />

SINGULUS NANO DEPOSITION<br />

TECHNOLOGIES GMBH<br />

Tel. +49 6188 440-417<br />

info@singulus-ndt.de<br />

STANGL Semiconductor<br />

Equipment <strong>AG</strong><br />

Tel. +49 8141 3600-0<br />

sales@stangl.de<br />

Netherlands<br />

SINGULUS MASTERING B.V.<br />

Tel. +31 407 5014-00<br />

info@singulus.nl<br />

Switzerland<br />

SINGULUS MOLDING <strong>AG</strong><br />

Tel. +41 52 63262-00<br />

sales@singulus-molding.ch<br />

Sales Subsidiaries<br />

France<br />

SINGULUS TECHNOLOGIES France S.A.R.L.<br />

Tel. +33 3 893111-29<br />

e-mail: singulus@club-internet.fr<br />

Great Britain<br />

SINGULUS TECHNOLOGIES UK Ltd.<br />

Tel. +44 1793 7842-00<br />

e-mail: brian.walsh@singulusuk.com<br />

Italy<br />

SINGULUS TECHNOLOGIES Italia s.r.l.<br />

Tel. +39 0717 9303-12<br />

e-mail: singulus.italia@fastnet.it<br />

Latin America<br />

SINGULUS TECHNOLOGIES Ltda. Latin America<br />

Tel. +55 1136 4301-13<br />

e-mail: latinamerica@singulus.com.br<br />

Smart Solutions to Drive the Future.<br />

Singapore<br />

SINGULUS TECHNOLOGIES Asia Pacific<br />

Tel. +65 674 119-12<br />

e-mail: singulus@singnet.com.sg<br />

Spain<br />

SINGULUS TECHNOLOGIES Iberica<br />

Tel. +34 936 7500-25<br />

e-mail: singulus@singulusib.com<br />

Taiwan<br />

SINGULUS TECHNOLOGIES Taiwan Ltd.<br />

Tel. +886 2 274833-66<br />

e-mail: sales@singulus.com.tw<br />

United States and Canada<br />

SINGULUS TECHNOLOGIES Inc.<br />

Tel. +1 860 68380-00<br />

e-mail: sales@singulus.com<br />

02/2008-MetaCom Printed in Germany - Technical alterations reserved

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